₹71.30 Crores | Listing at BSE | Wed, Oct 28, 2020 - Wed, Nov 11, 2020

Mold-Tek Packaging Limited Rights Issue comprises 0.0555 Cr equity shares aggregating to ₹71.30 Cr, offered at an issue price of ₹180 per share with a face value of ₹5 per share.
The record date for determining eligible shareholders is Oct 22, 2020, with the Rights Issue being offered in the entitlement ratio of 1:50.
As per the terms of payment, ₹180 per share payable on application, with the balance payable in call(s).
The Rights Issue opens on Oct 28, 2020 and closes on Nov 11, 2020.
The deemed date of allotment is Nov 18, 2020, following which the equity shares are expected to be credited to demat accounts on Nov 26, 2020 and listed on the BSE on Nov 27, 2020.
Emkay Global Financial Services Ltd. is the Lead Manager to the issue and MUFG Intime India Pvt.Ltd. is the Registrar to the Issue.
Investors are advised to refer to the Mold-Tek Packaging Limited Letter of Offer for detailed information, including risk factors, issue terms, and procedural details.
Record Date
Thu, Oct 22, 2020
Entitlement Ratio
1 : 50
Open Date
Wed, Oct 28, 2020
Close Date
Wed, Nov 11, 2020
| Particulars | For the year/period ended (Rs in Million) | ||
|---|---|---|---|
| 31-Mar-20 | 31-Mar-19 | ||
| Total Assets | 3,633.02 | 3,553.12 | |
| Total Revenue | 4,393.62 | 4,068.47 | |
| Profit After Tax | 374.38 | 319.18 | |
[Dilip Davda] Based on its financial track record and the price movement so far, issue is reasonably priced. However, performance of Q1 of FY21 marked setback and raises concern. No doubt, this set back is due to ongoing pandemic scenario and may not last long. Stakeholders having surplus funds may consider investment for long term as the company is offering investor friendly subscription options. (Subscribe for long term). Read detail review...
Mold-Tek Packaging Limited
8-2-293/82/A/700
Ground Floor Road No 36, Jubilee Hills,
Hyderabad, Telangana 500033
Hyderabad, Telangana, 500033
The Mold-Tek Packaging Rights Issue opens on Wed, Oct 28, 2020, and closes on Wed, Nov 11, 2020.
Mold-Tek Packaging Rights Issue Schedule
| Last Date for credit of Rights Entitlements | |
| Last Date for renunciation of Rights Entitlements | |
| Issue Opening Date | Wed, Oct 28, 2020 |
| Issue Closing Date | Wed, Nov 11, 2020 |
| Date of Allotment (on or about) | Wed, Nov 18, 2020 |
| Date of Credit (on or about) | Thu, Nov 26, 2020 |
| Date of Listing (on or about) | Fri, Nov 27, 2020 |
You can apply for Mold-Tek Packaging Rights Issue in two ways:
Steps to apply for Mold-Tek Packaging Rights Issue using Net Banking (ASBA)
Steps to apply for Mold-Tek Packaging Rights Issue using Registrar's website (R-WAP)